CYSH12AF (InSb) HALL-EFFECT ELEMENT
Hall-effect element CYSH12AF is made of compound
semiconductor material indium stibnite (InSb), which utilizes the
Hall-effect principle. It can convert a magnetic flux density signal
linearly into voltage output. It is new generation of Hall Effect
element CYTY101A.
FEATURES:
High Magnetic Sensitivity
Low Offset Voltage
Miniature Package
TYPICAL APPLICATION
• Magnetic Field Measurement
• Current Sensor
• Detection of Speed
• DC Brushless Motor
• Position Control
1. Maximum Ratings
|
Parameter
|
Symbol
|
Rating
|
Unit
|
|
Maximum Input Current
|
Imax |
20 (at 25°C)
|
mA |
|
Maximum Power Dissipation
|
Pmax |
150 (at 25°C)
|
mW |
|
Operating Temperature Range
|
Top |
－40
~ ＋120 |
°C |
|
Storage Temperature Range
|
Tst |
－40
~ ＋150 |
°C |
2. Electrical Characteristics (Measured
at 25°C)
|
Parameter |
Symbol |
Measurement Conditions |
Min |
Max |
Unit |
|
Output Hall Voltage |
VH |
Vin＝1V,
B＝500G
|
266 |
320 |
mV |
|
Input Resistance |
Rin |
I＝0.1mA
|
240 |
550 |
Ω
|
|
Output Resistance |
Rout |
I＝0.1mA
|
240 |
550 |
Ω
|
|
Offset Voltage |
VO |
Vin＝1V,
B＝0G
|
－7 |
＋7 |
mV |
|
Temp. Coeff. of VH |
α
|
Ta＝0
~
＋40°C
AVG. |
- |
－1.8 |
% /°C |
|
Temp. Coeff. of Rin, Rout |
β
|
Ta＝0
~
＋40°C
AVG. |
- |
－1.8 |
% /°C |
|
VH＝VHM－VO
(VHM : The output voltage measured at 500G.)
|
FUNCTIONAL BLOCK DIAGRAM
3. CHARACTERISTICS CURVE
4. Method for Mounting
4-1. Soldering Conditions on PCB
1. No Rapid Heating and Cooling.
2. Recommended Preheating condition is at 130~150°C for 2~3minutes.
3. Recommended Reflowing condition is at 220~230°C for 10~15seconds.
4-2. Soldering Method and Temperature
|
Items |
Methods |
Temperature |
|
Reflow
|
Soldering by Passing the Heated Zone |
Max 250°C in 20sec |
|
Solder
Iron |
Soldering by Soldering Iron |
Max 300°C in 3sec |
5. Packaging
5-1. Taping
1. SH12AF should be packed that marked side is viewed from cover
tape andlong side
is put parallel with tape running direction. Making use of itafter
180o rotation has no problem because of its symmetric mode.
2. The vacant parts more than 40mm are located at front and end side
of the reel.
5-2. Tape Specifications
1. Pull Strength(F) = 20~70g
4. Devices should be kept below 40°C and
below RH80% in the shade.
5. Tape has no joint.
5-3. Packing Unit
1. 3,000pcs of devices are packed in one reel.
2. Five reels are packed in one inner box.
3. Four inner boxes, 60,000pcs of devices, are packed in one outer
box.
4. Dummy could be packed for safe dealing.
6. External Dimensions (Unit: mm)
Four leads of input and output terminals are designed in the
diagonally symmetric mode and are equal in dimensions. Regardless of
180°rotation of Hall sensor, SH12AF can be used
7. Marking Method
Devices should be marked by a laser beam in the form of 「SS + 'Rank'
8. External Dimensions of Carrier
Tape (Unit: mm)
9. External Dimensions of Reel (Unit:
mm)
The above reel is made of plastic and is
recyclable.
10. RELIABILITY
10.1 TEST CONDITION
|
|
CONDITION
|
|
HIGH TEMP. STORAGE
|
Ta=110°C,t=1000HR |
|
LOW TEMP. STORAGE
|
Ta=-40°C,t=1000HR |
|
HIGH TEMP. OPERATION
|
Ta=100°C,Iopr=6mA,t=1000HR
|
|
LOW TEMP. OPERATION
|
Ta=-20°C,Iopr=6mA,t=1000HR
|
|
HIGH TEMP. HIGH UMIDITY
|
Ta=60°C,
HR=90%,Iopr=9mA,t=1000HR |
|
OPERATION |
|
|
HUMIDITY |
Ta=60°C,HR=90%, t=1000HR |
|
PCT |
Ta=121°C,HR=100%, Pv=2atm, t=24HR |
|
THERMAL SHOCK
|
T(L)=-55°C,T(H)=150°C, t=(L,H)=30min,M=30CYCLE
|
|
SOLDERING HEAT
|
solder
temp=250±5°C, t=10sec,REFLOW |
|
RESISTANCE
|
|
|
SOLDABILITY
|
solder
temp=230±5°C, t=5sec,dip |
|
TERMINAL STRENGTH
|
TENSION
300g/30sec |
|
SURGE |
V=500V,
C=200pF, R=0Ω (test method EIAJ EDX 8503)
|
10.2 CRITERION FOR JUDGING
After each reliability test, samples should be kept for at least 24
hrs at room temp. & humidity, and then measured.
The change rates should be confined within the ranges as follows.
|
Item
|
OK SPEC |
NG/OK |
|
ΔRin |
UNDER
±20% |
OK (SPEC
SATISFYING) |
|
ΔRout |
UNDER
±20% |
|
ΔVH |
UNDER
±20% |
|
ΔVo/VH |
UNDER
± 5% |
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