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CYD3141E SERIES
HALL-EFFECT SWITCH ICS

CYD3141E series Hall-effect switch integrated circuits for high temperature operating based on Hall-effect principle, apply the semiconductor monolithic technology, which includes a voltage regulator, Hall voltage generator, differential amplifier, Schmitt trigger and an open-collector output on a single silicon chip. ICs can convert the input magnetic field signal into digital voltage output.

FEATURES

TYPICAL APPLICATION

 Small size
 High Sensitivity
 Quick Response
 Good Temperature Performance
 High Accuracy
 Excellent Reliability

Non-contact Switch
Automotive Ignition
Brake ICs
Position control
Revolution detection
Safe alarm device
Textile control system

FUNCTIONAL BLOCK DIAGRAM

ABSOLUTE MAXIMUM RATINGS

Parameter

Symbol

Value

Unit

Supply Voltage

Vcc

28

V

Quiescent Output Voltage

Vo

28

V

Output Current

Io

25

mA

Operating Temperature Range

TA

-4085

°C

Storage Temperature Range

TS

-65150

°C

Magnetic-Electrical
Transfer Characteristics

ELECTRICAL CHARACTERISTICS

Parameter

Test Condition

Symbol

Value

Unit

Min

type

max

Supply Voltage

Vcc=4.5V24V

VCC

4.5

-

24

V

Output Low Voltage

Vcc=4.5v, Vo=24V Io=20mA, B≥BOP

VOL

-

175

400

mV

Output Leakage Current

Vo=24V, B<BRP

IOH

-

<1.0

10

μA

Supply Current

Vcc=24V, Vo open-collector output

Icc

-

3.0

9.0

mA

Output Rise time

Vcc=12V, RL=820Ω

CL=20pF

tr

-

0.2

2.0

μS

Output Fall time

tf

-

0.18

2.0

μS

Magnetic Characteristics

Parameter

Min (mT)

Typ (mT)

Max (mT)

Operate Point (BOP)

TA=25C

5.0

10.0

16.0

Full Operating Temperature Range

3.0

10.0

17.5

Release Point (BRP)

TA=25C

1.0

4.5

13.0

Full Operating Temperature Range

1.0

4.5

14.5

Hysteresis (BH)

TA=25C

2.0

5.5

8.0

Full Operating Temperature Range

2.0

5.5

8.0

Package Outline Drawing (Unit: mm)


Pin Notes: 1. Power Supply, 2. Ground, 3. Output

Cautions:

1) It is possible that outside mechanical stress affects the operating point and the release point of Hall-effect circuit, therefore, mechanical stress should be lessened as far as possible in the process of assembly;

2) Pay attention to the soldering temperature at the leads; keep it lower in a short time to guarantee good soldering quality.

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