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CYD1024 HALL-EFFECT SWITCH ICs |
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CYD1024 Hall-effect switches are
monolithic integrated circuits, which are composed of a reverse
protector, voltage regulator, Hall voltage generator, differential
amplifier, Schmitt trigger and an open-collector output on a single
silicon chip. ICs can convert the changeable magnetic field signal
into digital voltage output.
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FEATURES
• High Sensitivity
• Resistant to Physical Stress
• Wide Supply Voltage Range
• Interfacing with All Kinds of Logic Circuits |
TYPICAL APPLICATION
• High Sensitive Non-contact Switch
• DC Brushless Motor
• DC Brushless Fan
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FUNCTIONAL BLOCK DIAGRAM
Magnetic-Electrical Transfer Characteristics
ABSOLUTE MAXIMUM RATINGS
|
Parameter
|
Symbol
|
Value
|
Unit
|
|
Min
|
Max |
|
Supply
Voltage |
Vcc
|
4.5
|
20
|
V
|
|
Magnetic
Flux Density |
B
|
unlimited
|
mT
|
|
Output
Current |
Io
|
- |
25
|
mA
|
|
Operating
Temperature Range |
TA |
-20
|
+100
|
°C
|
|
Storage
Temperature Range |
Ts
|
-55
|
+150
|
°C
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ELECTRICAL CHARACTERISTICS
|
Parameter
|
Test
Condition |
Symbol
|
Value
|
Unit
|
|
Min
|
type |
max |
|
Supply
Voltage |
|
VCC
|
4.5
|
- |
20.0
|
V
|
|
Output Low
Voltage |
Vcc=4.5V
B=20mT |
Vo=Vccmax
Io=25mA |
VOL |
- |
0.2
|
0.4
|
V
|
|
Output
Leakage Current |
Vo=Vccmax,
|
Vcc
open-collector output |
IOH |
- |
0.1
|
10.0
|
μA
|
|
Supply
Current |
Vcc=Vccmax
|
Vo
open-collector output |
Icc
|
- |
8.0
|
12.0
|
mA
|
|
Output Rise
time |
Vcc=12V CL=20pF
RL=480KΩ |
tr |
- |
0.3
|
1.5
|
μS
|
|
Output Fall
time |
tf |
- |
0.3
|
1.5
|
μS
|
|
|
|
|
|
|
|
|
|
|
|
Magnetic
Characteristics (Unit: mT)
|
Parameter |
Rank
|
Value
|
Unit
|
|
Min
|
Typ
|
Max
|
|
Operate
Point (BOP) |
A11 |
- |
- |
8
|
mT |
|
|
|
|
|
|
|
A12 |
- |
- |
10
|
|
A2 |
- |
- |
15
|
|
B
|
- |
- |
20
|
|
Release
Point (BRP) |
A11 |
-8
|
- |
- |
|
A12 |
-10
|
- |
- |
|
A2 |
-15
|
- |
- |
|
B
|
-20
|
- |
- |
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Hysteresis |
(BH)
|
|
2
|
6
|
- |
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Cautions:
1) It is possible that outside
mechanical stress affects the operating point and the release point
of Hall-effect circuit, therefore, mechanical stress should be
lessened as far as possible in the process of assembly;
2) Pay attention to the soldering temperature at the leads; keep it
lower in a short time to guarantee good soldering quality.
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